As the first technology company in China to develop and service ARM tools, Infineon has been focusing on embedded product solutions for 15 years. In 2016, the company developed the WaRP7 platform tailored for the Internet of Things and the wearable market. The platform is the industry's first IoT development platform using the ARM Cortex-A7+Cortex-M4 dual-core off-board processor. The first integrated NFC, BLE, and WiFi, and the mikroBUS can be connected to more than 200 extended click boards. The first IoT and wearable device development platform with multiple perceptions such as magnetic accelerometers, gyroscopes, and barometers. Its outstanding platform features and ease of use were nominated for the 2017 IOT Conference Technology Innovation Awards hosted by e-bikes.
The platform consists of a motherboard and a daughter board. The motherboard is based on the i.MX 7Solo application processor with an advanced ARM® Cortex®-A7 core implementation and an ARM® Cortex®-M4 core. This unique heterogeneous multi-core architecture supports low-power modes that are critical to most designs, while also delivering the power to drive advanced operating systems and rich user interfaces. The daughter board is based on a flexible design with sensors that collect a variety of data, supports more than 200 Click BoardsTM MikroBusTM expansion slots, and supports rapid prototyping for all wearable product usage models.
WaRP7 includes a wide range of onboard connectivity features including Wi-Fi, Bluetooth, NFC, and other hardware features such as sensors, 12GB multi-chip memory modules, rechargeable batteries and power management.
WaRP7 is a powerful low-cost development platform for evaluation and rapid prototyping that addresses the key challenges currently facing the IoT and wearable markets, such as battery life, connectivity, user experience and miniaturization.
feature:
· Provide a rapid prototyping platform to speed time to market, allowing you to focus on improving product differentiation
Pre-verified USB, NFC, Bluetooth®, Bluetooth Smart and Wi-Fi® connectivity
· Component selection and board design optimized to reduce power consumption and reduce specifications
·Open source hardware and software
Full-featured AndroidTM and Linux® operating systems simplify software developer development
Key points of innovation:
Advanced multi-core off-the-shelf processor: NXP i.MX 7Solo application processor, which has a critical impact on low-power design
Reliable storage: Kingston MCP with 8 GB NAND flash and 4Gb LPDDR3 storage
· Support multiple connections: NXP NT3H1101 NFC Tag IC, Murata Wi-Fi® (802.11/b/g/n) and Bluetooth (4.1 Bluetooth Smart + EDR) modules
Power Management: 180 mAh Lithium Battery, NXP BC3770 Battery Charger and NXP PF3001 Power Management IC
·Multiple perception: NXP MPL3115A2, FXOS8700, FXAS21002 and other sensors
Multimedia support: MIPI display, MIPI camera, audio playback and recording
· Easy to expand: Support up to 200 or more extended Click Boards via mikroBUS socket
·Safe and reliable: Has passed FCC, CE certification
WaRP7 is a development platform that is close to the meaning of a complete product. It is compact, and in addition to the advantages of traditional development tools, it also has enough flexibility, security and low power control. It integrates advanced multi-core asynchronous processor NXP i.MX 7Solo, 8 GB Kingston NAND flash and 4Gb LPDDR3 storage, NFC, WiFi, BLE4.1, power management, multiple sensors and more.
About English
Founded in 2000, Infinex is a wholly-owned subsidiary of Premier Farnell (Asia Pacific, e-Community, London Stock Exchange: PFL). Infineon specializes in providing easy-to-use development tools, reference design platforms, and mass-produced product solutions for embedded development engineers worldwide, as well as a full-service, one-stop shop for fast mass production and global point-to-point logistics. To help customers shorten the time to market, improve quality and reduce costs.
2017 China IoT Conference Introduction
The China IoT Conference was held by Huaqiang Jufeng's Million Electronic Engineer Platform Electronic Enthusiasts Network. The conference has been successfully held for 3 sessions. In the form of “Grand Forum + Sub-forumâ€, 100+ global famous manufacturers have gathered and successfully attracted 6,000+. The names of electronic semiconductor practitioners signed up for the event, affecting 200,000+ electronic engineers.
We are committed to guiding China's IoT wind vane, gathering global IoT industry leaders, analyzing the potential market value of various industries, exposing the latest technology solutions, providing the best communication platform, and striving to build an IoT ecosystem with many partners.
Time: December 6-7, 2017
Location: Shenzhen, China
Expected size: 2,000+
Conference planning:
Morning of December 6th: IoT Development Summit
Afternoon of December 6th: Four Technology Forums (Sensors, IoT Security, Power Management, Artificial Intelligence) + Seven Application Forums (Smart Home, Wearables, Smart City, Smart Lighting, Smart Machines/Unmanned Vehicles, Industrial Products) Networking, smart car)
Evening on December 6th: Awards Ceremony, Strategic Cooperation Exchange Dinner; during the dinner: New CEO Award (10), Technology Innovation Award (20), Product Golden Lion Award (30)
Morning of December 7: Analyst Breakfast Meeting, IoT Investment Forum
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