Molex Releases SpeedStack Connector System

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Molex , the world's leading provider of complete interconnect products, introduces the high-density, low-side, high-speed solution SpeedStack TM mezzanine connector system that supports data rates up to 40 Gbps per differential pair. This connector system includes telecommunications, networking, Ideal for OEMs with limited PCB space in military, medical electronics and consumer electronics industries, with a stack height of 4.00 to 10.00mm and a pitch of 0.80mm, providing design engineers with ultimate flexibility. In order to meet space constraints without sacrificing performance.

Adam Stanczak, Molex's new product development manager, said: "The market is in high demand for a universal high-density board-to-board mezzanine solution with space savings, high data rates and optimal airflow characteristics at low stack heights. Molex SpeedStack Connector System Not only does it provide a high-speed solution with low side height, but it also features a special narrow enclosure design that allows airflow to pass and enhance system cooling performance."

The SpeedStack connector system offers 22, 44, 60, 82, 104 and 120 circuit sizes, as well as a range of 6 to 32 differential pairs for greater flexibility. The 100 Ohm design provides excellent impedance control. Molex will introduce the 85 Ohm model in June 2013 to support PCIe* Generation (Gen) 3.0 and Intel QuickPath Interconnect (QPI) for next-generation I/O and memory signals. )Claim. The insert-molded wafer design features a protective shielded enclosure that supports end position and improves electrical balance. Shared ground pins help provide electrical performance and minimize crosstalk.