Toshiba Introduces Dual Unipolar Stepper Motor Driver IC

    Small package with 80V (absolute maximum rating) high voltage process

    Tokyo-Toshiba Corporation (TOKYO:6502) today announced the introduction of a dual unipolar motor driver chip (IC) TB67S158 for stepper motors. Sample shipments start on the same day, and volume production is scheduled to start in October.

    The number of motors and driver ICs required for entertainment gaming consoles, home appliances and industrial equipment is increasing. In addition, manufacturers are being asked to reduce their equipment size to save space and reduce energy consumption. Therefore, it is increasingly desired that the driver IC can play multiple roles in the drive motor.

    Toshiba's current driver IC "TB67S149" can only control one single-stage motor, but the new "TB67S158" can support dual-motor control by integrating an 8-channel metal-oxide-semiconductor field-effect transistor (MOSFET) output. For example, by setting the output to a constant voltage control mode, a 4-channel output can control one motor, while another 4 channels can control another motor. With this feature, the "TB67S158" can be used in a variety of devices and meet a variety of needs.

    Toshiba's latest analog high-voltage process (80V) is used to integrate a monolithic package [1] to achieve a miniaturized high-radiation surface mount package (QFN) and lead-embedded package (SDIP) for assembly. This package layout meets the diverse needs of space-saving devices and supports reduced component count for device miniaturization.

    chipChip 2

    Main features of new products

    Double monopole

    The “TB67S158” integrates an 8-channel MOSFET output to control dual single-stage motors simultaneously.

    Monolithic structure

    The monolithic structure is integrated by using the latest analog high voltage process (BiCD 130 nm, 80V). This reduces installation space and reduces component count compared to processes based on transistor array-based control circuit packages.

    Two package options are available depending on the application

    Choose from surface mount QFN packages that are ideal for shrinking module and device sizes; assembled SDIP packages for assembly.

    Built-in error detection circuit

    The TB67S158 integrates an overtemperature protection circuit and an overcurrent shutdown circuit. Higher device safety and reliability are maintained by displaying an error (ERR) signal at runtime.

    application

    Entertainment game consoles such as pachinko and screen slot machines; household appliances such as refrigerators and air conditioners; industrial equipment, including bank terminals, offices and factory automation equipment.

    Main specifications of new products

    Main specification 2

    • Note 1: An electronic circuit mounted on a semiconductor-based monolithic material or single wafer. Single chip single package.

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