Organizer: China Electronic Materials Industry Association
Organizer: Beijing Wansheng Boxun High-Tech Development Co., Ltd.
                 China Electronic Materials Network
Supported by: Jiangsu Nanda Optoelectronic Materials Co., Ltd.
Suzhou Jinhong Gas Co., Ltd.
Meeting time: June 23, 2011 (Thursday) ~ 24 (Friday)
[Report on the 23rd, meeting on the 24th]
Venue: Suzhou Chunshen Lake Hotel
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I. Conference background and theme
In 2011, the year of the “12th Five-Year Plan†in China, the golden period of LED industry development was ushered in. As an important emerging industry for the development of green energy, LED is strongly supported by countries all over the world and by the Chinese government. The enterprises have actively participated in the development of the industry. The rapid expansion of the LED industry and its market provides a good opportunity for the development of the LED raw material industry. Raw materials for LEDs are an important foundation for the development of the LED industry. The key materials for LEDs represented by chips and epitaxial materials, substrate materials, luminescent materials, packaging materials, heat-dissipating materials, process auxiliary materials, etc. have played an important role in promoting the improvement of LED technology level and product upgrading. In particular, with the improvement of LED luminous efficiency, materials play an important role in solving the problem of reducing the cost of LED components and improving the performance of LED devices.
The development of LED materials requires communication and cooperation between upstream and downstream enterprises to gain an in-depth understanding and master the latest developments and trends in the world's recent LED frontier technologies and market demand for materials. To this end, China Electronic Materials Industry Association will be held on June 23, 2011~ Organized " 2011 in Suzhou" on the 24th LED industry and its material technology, market high-level forum , aims to promote the technological innovation of LED materials companies and build a strong industrial chain of China's LED industry.
This high-level forum is the first high-level forum for the successful completion of this theme by the China Electronic Materials Industry Association in Dalian in 2010. Government officials, well-known academics, LED industry entrepreneurs, and technical experts will be invited to give wonderful lectures, and deeper and more explicit exchanges on topics such as new trends and key technologies in LED material technology and market development at home and abroad. Explore.
We sincerely welcome professionals from the LED industry and its materials industry to participate in this event.
Second, the report title and the reporter
Report topic | Reporting unit | reporter |
Industry development status and development trend | ||
Thoughts and Suggestions on the Development of LED Industry in China during the Twelfth Five-Year Plan | IC Division, Electronic Information Division, Ministry of Industry and Information Technology | Director Ren Aiguang |
Current status of technology development at home and abroad in the LED industry and requirements for material properties | Hangzhou Silan Mingxin Technology Co., Ltd. | Jiang Zhongyong General Manager |
LED domestic equipment development opportunities and challenges | Northern Microelectronics Co., Ltd. | General Manager Zhao Jinrong |
Package and its materials | ||
New development of LED packaging technology at home and abroad | Director of the National Key Joint Laboratory of Integrated Optoelectronics, Tsinghua University | Professor Luo Yi |
Research progress of LED packaging materials | Changzhou Institute of Chemistry, Chinese Academy of Sciences Director of Changzhou New Light Source Materials and Technology Key Laboratory | Dr. Zhang Baotan |
Technical development of conductive adhesive for LED at home and abroad | Guangdong Fenghua High-tech Co., Ltd. | Chen Wei Project Manager |
Backlight and its heat dissipation substrate | ||
Current status and development trend of technology and industry of LED backlight components for TFT-LCD | Tsinghua University LCD Center | Professor Zhang Baizhe |
Kunshan Longteng Photoelectric Co., Ltd. | Dr. Jianting Xian | |
Suzhou BOE Tea Valley Electronics Co., Ltd. | Hou Yan Technical Director | |
LED backlight module market and its requirements for heat sink substrate materials | Zhejiang Tianle Microelectronics Technology Company Limited | Liu Jingwei Chief Engineer |
Expansion of the metal-based PCB market for LEDs at home and abroad and performance requirements | Shenzhen Enda Electronics Co., Ltd. | Vice President He Peiyan |
Discussion on properties and process technology of high thermal conductivity metal-based copper clad laminate | (å°)Lianmao Electronics Co., Ltd. | General Manager Zhang Zhankang (Taiwan factory) |
Performance of high thermal conductivity CEM-3 composite copper clad laminate and its application in LED backlight module | (Japan) Matsushita Electric Works Co., Ltd. | Suzuka Takashi |
Improvement of the performance of metal-based copper clad laminates and problems to be solved by the process | Zhejiang Huazheng New Materials Co., Ltd. R & D Department | Jiang Wei Gao Gong |
LED chip , substrate | ||
New developments in the development of silicon carbide substrate technology for LED Â Â Â Â Â | Researcher, Institute of Physics, Chinese Academy of Sciences | Dr. Chen Xiaolong |
Development and review of localization of LED epitaxial chips | The 13th R&D Center of CLP Group | Professor Zhang Wansheng |
Development of LED chip technology | Peking University Wide Band-Gap Semiconductor Research Center | Dr. Tong Yuzhen |
Performance and Process Technology of GaAs Materials for LED Substrate | Zhongke Jingdian Information Materials (Beijing) Co., Ltd. | Yu Huiyong, Chief Engineer |
Technical progress of substrate sapphire sheets for LED | Zhongke GCL (Suzhou) Industrial Co., Ltd. Shanghai Institute of Ceramics, Chinese Academy of Sciences - Director and Researcher of GCL Sapphire Crystal Materials R&D Center | Xu Jun Executive Dean |
Other materials | ||
MO source production technology and industry development | Jiangsu Nanda Optoelectronic Materials Co., Ltd. | President Li Jianhua |
Application Research of Electron Gas in LED Devices | Suzhou Jinhong Gas Co., Ltd. | Yan Haifeng General Manager |
Note: The final agenda of the report is subject to actual on-site speech. | ||
Third, invite leaders and participants
(1) Leaders of relevant government ministries.
(2) LED components and materials manufacturers, including backlight modules, substrate materials, packaging materials, heat dissipation substrates (PCB), high thermal conductivity copper clad laminates and their raw materials, special gases, chips and epitaxial wafer manufacturing process auxiliary materials Senior executives, market sales personnel, engineering and technical personnel, etc. of related production companies. Representative of the manufacturer of LED material production equipment.
(3) Engineering and technical personnel of the production enterprises of the LED industry chain.
(4) Domestic LED industry park management personnel. Industry experts and scholars, research institutes, research institutions, related design institutes, etc.; relevant media, websites; relevant large-scale enterprise planning department personnel, investors, brokers, etc.
Fourth, the meeting time and place
Meeting time: June 23, 2011 (all day): Representatives report.
The theme report of the main venue from 8:30 to 12:00 on June 24;
The special report of the venue from 13:30 to 17:30.
Venue: Suzhou Chunshen Lake Hotel
Hotel Address: No. 28 Chunqiu Road, Xiangcheng District, Suzhou City
Hotel phone
vehicle route:
(1) Suzhou Railway Station to the hotel: Take a taxi to Guangji North Road to Sun Road and go straight to the left for 3 minutes, the cost is about 25 yuan;
(2) Shanghai Hongqiao Airport to the hotel: Hongqiao Airport takes the high-speed rail to the Suzhou Railway Station, then refer to Route 1;
(3) Wuxi Shuofang Airport to the hotel: take the taxi Dongqiao exit and drive for 10 minutes, the cost is about 120 yuan.
V. Registration for the conference
Please attend the meeting staff to fill in the "Conference Receipt" and fax it to 010-64476900 (the Organizing Committee) before June 10, 2011.
The attendance fee for the delegates is 1,300 yuan/person, including conference, conference materials, meals, etc. The meeting will arrange accommodations at a reasonable cost. You can enjoy the 1200 yuan/person preferential price by registering before June 10th and paying for the conference fee.
Meeting fee remittance account:
Account Name: Beijing Wansheng Boxun High-Tech Development Co., Ltd.
Bank of deposit: Industrial and Commercial Bank of China Beijing Beichen Road Branch
Bank account
Six, contact information
Organizing Committee of the Conference: Economic and Technical Management Department of China Electronic Materials Industry Association
Contact: Miss Zhao
Phone: 010-64476902-605
Fax: 010-64476900
mailbox:
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