[Source: "High - tech LED - Technology and Applications" November issue ]
In the past few years, the global consumer demand for LEDs has shown a rapid growth trend, which also spurred the majority of LED manufacturers to urgently hope to develop new LED production processes, especially with faster speed, higher precision and lower The cost of the chip dicing process, in order to effectively increase the output of LED.
Traditional chip separation is mainly based on mechanical methods, including saw blade cutting and diamond dicing process, which usually has many defects such as low chip separation quality, slow stroke/slice speed, low yield and low yield, and then developed. The laser dicing process has basically overcome these problems and can meet the increasing market demand. Therefore, it has become a major process in the current LED chip fabrication process, and III-V semiconductors that have been grown on sapphire substrates and silicon carbide substrates. The production process of GaN-based LED chips has been widely used. It is particularly noteworthy that in the entire LED chip manufacturing process equipment, the purchase cost of the laser dicing machine has become the second highest equipment after the MOCVD equipment.
However, like other key technologies in the LED field, foreign laser manufacturers have already made careful and extensive patent distribution in developed countries and regions such as the United States, Japan and Europe. Therefore, this technical field has also become one of the patent minefields that many LED industry latecomers must be careful to guard against.
It is true that because patents are regional in nature, if the factors such as product export are not considered at all, the above-mentioned foreign patents related to laser dicing technology will hardly affect any LED manufacturers in mainland China (hereinafter referred to as "domestic"), but Considering the consistent style of foreign manufacturers, it is very likely that the relevant patents will be deployed in China, and then it is likely to pose a serious threat to domestic LED manufacturers in China. Therefore, the author conducted preliminary statistics and analysis on domestic patents related to laser dicing technology.
Referring to Figure 1 and Figure 2, as of October 2012, in the published domestic patents, there are about 287 more important invention patent applications and 14 more important utility model patents directly related to laser dicing technology. The scope includes laser dicing equipment and its design, manufacturing and use methods, laser dicing methods, and LED device structures and processing methods thereof. Moreover, from 1995 to 2011, the total number of patent applications in each year has continued to grow, which should be able to explain to a certain extent that the LED industry is very concerned about laser dicing technology.
Applicants for the aforementioned 301 patents mainly originated from mainland China, Japan, the United States, South Korea and Taiwan, and a small number of applicants from Switzerland, Germany, Ireland, the Netherlands and Singapore. However, referring to Figure 3, in the aforementioned 301 patent applications, more than 60% are held by applicants from non-Chinese mainland regions, and less than 40% are held by applicants from mainland China, and foreign applicants The patent layout began in mainland China in 1995, which was also much earlier than domestic applicants. In particular, it is necessary to note that nearly 50% of the aforementioned 301 patents are held by Japanese applicants, and all of them are invention patents. Compared with domestic applicants, they show obvious in both the number of patents and the quality of patents. Advantage.
Unfinished
For more information, please refer to "High - tech LED - Technology and Applications" November issue
In the past few years, the global consumer demand for LEDs has shown a rapid growth trend, which also spurred the majority of LED manufacturers to urgently hope to develop new LED production processes, especially with faster speed, higher precision and lower The cost of the chip dicing process, in order to effectively increase the output of LED.
Traditional chip separation is mainly based on mechanical methods, including saw blade cutting and diamond dicing process, which usually has many defects such as low chip separation quality, slow stroke/slice speed, low yield and low yield, and then developed. The laser dicing process has basically overcome these problems and can meet the increasing market demand. Therefore, it has become a major process in the current LED chip fabrication process, and III-V semiconductors that have been grown on sapphire substrates and silicon carbide substrates. The production process of GaN-based LED chips has been widely used. It is particularly noteworthy that in the entire LED chip manufacturing process equipment, the purchase cost of the laser dicing machine has become the second highest equipment after the MOCVD equipment.
However, like other key technologies in the LED field, foreign laser manufacturers have already made careful and extensive patent distribution in developed countries and regions such as the United States, Japan and Europe. Therefore, this technical field has also become one of the patent minefields that many LED industry latecomers must be careful to guard against.
It is true that because patents are regional in nature, if the factors such as product export are not considered at all, the above-mentioned foreign patents related to laser dicing technology will hardly affect any LED manufacturers in mainland China (hereinafter referred to as "domestic"), but Considering the consistent style of foreign manufacturers, it is very likely that the relevant patents will be deployed in China, and then it is likely to pose a serious threat to domestic LED manufacturers in China. Therefore, the author conducted preliminary statistics and analysis on domestic patents related to laser dicing technology.
Referring to Figure 1 and Figure 2, as of October 2012, in the published domestic patents, there are about 287 more important invention patent applications and 14 more important utility model patents directly related to laser dicing technology. The scope includes laser dicing equipment and its design, manufacturing and use methods, laser dicing methods, and LED device structures and processing methods thereof. Moreover, from 1995 to 2011, the total number of patent applications in each year has continued to grow, which should be able to explain to a certain extent that the LED industry is very concerned about laser dicing technology.
Applicants for the aforementioned 301 patents mainly originated from mainland China, Japan, the United States, South Korea and Taiwan, and a small number of applicants from Switzerland, Germany, Ireland, the Netherlands and Singapore. However, referring to Figure 3, in the aforementioned 301 patent applications, more than 60% are held by applicants from non-Chinese mainland regions, and less than 40% are held by applicants from mainland China, and foreign applicants The patent layout began in mainland China in 1995, which was also much earlier than domestic applicants. In particular, it is necessary to note that nearly 50% of the aforementioned 301 patents are held by Japanese applicants, and all of them are invention patents. Compared with domestic applicants, they show obvious in both the number of patents and the quality of patents. Advantage.
Unfinished
For more information, please refer to "High - tech LED - Technology and Applications" November issue
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