[Text|High-tech LED reporter Luo Shenghua] On June 8, 2015, the 13th Gaogong LED Summit Forum was held at Langham Place, Nanfeng, Guangzhou. This session is based on the topic of "LED lighting life and death in this battle", focusing on the new round of LED lighting industry, how to seize the opportunity and win the commanding heights of strategic victory.
In the LED lighting industry, which is widely believed to be the finale in three years, 2015 is a crucial year. Under the tide of expansion, mergers and acquisitions and bankruptcies, the competition strength between LED lighting companies is widening. Although the number of “billion-class†aircraft carrier enterprises is increasing, the survival pressure of small and medium-sized lighting enterprises is also expanding. For companies, how to survive in the cracks of the crowds is very crucial.
“The industry is mature, and the industry’s understanding of the industry is deepening.†In the forum, Zhou Xuejun, director of marketing for Lumileds (“亮â€) Asia, believes that companies must identify their own positioning and innovate to gain new living space.
LED is essentially an electronic product. It must be groundbreaking and inseparable from innovation. Zhou Xuejun analyzed the future direction of LED innovation from the aspects of substrate, DROOP (light reduction), package innovation (CSP) and modularization and performance roadmap. . He believes: "The industrial characteristics of LED will become more and more prominent, and the new packaging form will change the competitive landscape."
Zhou Xuejun said that in the past two years, with the continuous improvement of packaging technology, LED performance has been continuously improved. In the future, LED devices must be smaller and smaller, material costs will be lower and lower, and lamps will gradually become lighter and thinner. At the same time, the evolution of the LED package is similar to that of the traditional semiconductor package. From large to small, from small to miniaturized, the integration will be higher and higher.
For the miniaturization of LED devices, Zhou Xuejun mentioned the more popular chip-scale package (CSP), chip-level package can reduce the material cost of 40% to 50%, the volume becomes smaller, and the heat dissipation will be better. Therefore, the future trend of high-power LED chips will be chip-level packaging, chip-level packaging will also drive down the cost, withstand higher drive power, improve lumens per watt.
Speaking of medium-power LEDs, Zhou Xuejun said that the products of low- and medium-power LEDs are relatively mature, but the competition in this field is very fierce. If you want to provide a full range of services, you must provide a wide variety of package forms. To meet different lighting needs, because the lighting industry itself is very complicated. He also said that the next-generation LED package will exhibit the following features: higher lumen output, single-point color conversion, wide-area color coverage, and precise color point control.
Zhou Xuejun said that the distinction between the middle-power LED and the high-power LED in the future will not be obvious. Future chips will also offer different flexibility to the design of the luminaire. The same luminaire has different requirements for the chip in different occasions. If it is necessary to ensure a certain cost and maintain high reliability, the CSP method can be adopted. If the general household lighting is used, the general packaging method can be used, so that the product can be easily separated.
Therefore, in the future packaging industry trends, various package forms will continue to coexist for a long time, they will maintain their respective characteristics and applications. Zhou Xuejun hopes that the future LED industry is not a competition to the bottom of the valley, but a competition to climb the peak. No matter how the future trend changes, how to reduce the cost of the enterprise, the pursuit of light quality will never change.
In the LED lighting industry, which is widely believed to be the finale in three years, 2015 is a crucial year. Under the tide of expansion, mergers and acquisitions and bankruptcies, the competition strength between LED lighting companies is widening. Although the number of “billion-class†aircraft carrier enterprises is increasing, the survival pressure of small and medium-sized lighting enterprises is also expanding. For companies, how to survive in the cracks of the crowds is very crucial.
Lumileds ("Bright") Asia Regional Marketing Director Zhou Xuejun
“The industry is mature, and the industry’s understanding of the industry is deepening.†In the forum, Zhou Xuejun, director of marketing for Lumileds (“亮â€) Asia, believes that companies must identify their own positioning and innovate to gain new living space.
LED is essentially an electronic product. It must be groundbreaking and inseparable from innovation. Zhou Xuejun analyzed the future direction of LED innovation from the aspects of substrate, DROOP (light reduction), package innovation (CSP) and modularization and performance roadmap. . He believes: "The industrial characteristics of LED will become more and more prominent, and the new packaging form will change the competitive landscape."
Zhou Xuejun said that in the past two years, with the continuous improvement of packaging technology, LED performance has been continuously improved. In the future, LED devices must be smaller and smaller, material costs will be lower and lower, and lamps will gradually become lighter and thinner. At the same time, the evolution of the LED package is similar to that of the traditional semiconductor package. From large to small, from small to miniaturized, the integration will be higher and higher.
For the miniaturization of LED devices, Zhou Xuejun mentioned the more popular chip-scale package (CSP), chip-level package can reduce the material cost of 40% to 50%, the volume becomes smaller, and the heat dissipation will be better. Therefore, the future trend of high-power LED chips will be chip-level packaging, chip-level packaging will also drive down the cost, withstand higher drive power, improve lumens per watt.
Speaking of medium-power LEDs, Zhou Xuejun said that the products of low- and medium-power LEDs are relatively mature, but the competition in this field is very fierce. If you want to provide a full range of services, you must provide a wide variety of package forms. To meet different lighting needs, because the lighting industry itself is very complicated. He also said that the next-generation LED package will exhibit the following features: higher lumen output, single-point color conversion, wide-area color coverage, and precise color point control.
Zhou Xuejun said that the distinction between the middle-power LED and the high-power LED in the future will not be obvious. Future chips will also offer different flexibility to the design of the luminaire. The same luminaire has different requirements for the chip in different occasions. If it is necessary to ensure a certain cost and maintain high reliability, the CSP method can be adopted. If the general household lighting is used, the general packaging method can be used, so that the product can be easily separated.
Therefore, in the future packaging industry trends, various package forms will continue to coexist for a long time, they will maintain their respective characteristics and applications. Zhou Xuejun hopes that the future LED industry is not a competition to the bottom of the valley, but a competition to climb the peak. No matter how the future trend changes, how to reduce the cost of the enterprise, the pursuit of light quality will never change.
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