Fully compliant with Bluetooth 4.2 chips, modules and software provide superior design flexibility for IoT developers to achieve cost savings
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21ic Microchip Technology Inc. (National Microchip Technology Inc.) today announced the next generation of Bluetooth Low Energy (LE) solutions. The IS1870 and IS1871 Bluetooth LE RF ICs and BM70 modules comply with the latest Bluetooth 4.2 standard, extending not only Microchip's existing Bluetooth portfolio, but also worldwide regulatory and Bluetooth Technology Alliance (SIG) certification. These new products are ideal for IoT and Bluetooth beacon applications, allowing designers to easily use the low power and simplicity of Bluetooth low-power connections.
Microchip's new Bluetooth low energy devices include an integrated Bluetooth 4.2 firmware stack. Developers can achieve up to 2.5 times faster data transfer speeds and higher connection security, and support government-grade (FIPS-based) secure connections. Data is transmitted and received over the Bluetooth link in transparent UART mode, making it easy to integrate with any processor or Microchip's hundreds of PIC® microcontrollers with UART interfaces. In addition, the new module supports independent "hostless" operation of beacon applications.
Sumit Mitra, vice president of wireless solutions at Microchip, said: "The IS1870 and IS1871 ICs provide our chip customers with top-of-the-line Bluetooth 4.2 performance, while the BM70 module allows our customers to eliminate the expense and product delays due to regulatory certification. By providing one-stop shopping, including our own Bluetooth protocol stack, customers get proven interoperability and one-on-one support from Microchip's worldwide network of wireless experts."
These new devices optimize power distribution, minimizing current consumption and extending battery life. In addition, these new devices are compact in size with a minimum RF IC size of 4x4 mm and a module minimum size of 15x12 mm. The module options are RF-regulated and can also provide uncertified (unshielded/no antenna) modules for smaller and remote antenna designs for self-issued end product launch certification.
Microchip's Bluetooth low energy modules contain all the hardware, software, and certifications that designers need. Developers can easily submit their products to the Bluetooth Technology Alliance (SIG) using Microchip's Bluetooth QDID certification. Embedded Bluetooth stack configuration files include GAP, GATT, ATT, SMP, and L2CAP, as well as proprietary services for transparent UARTs. All modules can be configured using Microchip's Windows®-based operating tools.
Development support
Microchip also announced the BM70 Bluetooth Low Energy PICtailTM/PICtail Plus Daughter Board. This new tool can be connected to a PC via a USB interface or via a connection to Microchip's existing microcontroller development boards such as the Explorer 16, PIC18 Explorer and PIC32 I/O expansion boards. The BM-70-PICTAIL is available now.
Supply
The IS1870 Bluetooth LE RF IC is available in a 48-pin 6x6 mm QFN package and is sampling now and is in volume production. The IS1871 is available in a 32-pin 4x4 mm QFN package and is expected to be available in November from 1,000-piece quantities. The 30-pin BM70 Bluetooth low energy module is available now, with both a built-in PCB antenna version and a version without a built-in PCB antenna.
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